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  nichia sts-da1-2292 nichia corporation specifications for warm white led ncsl119t-h3 pb-free reflow soldering application built-in esd protection device rohs compliant
nichia sts-da1-2292 1 specifications (1) absolute maximum ratings item symbol absolute maximum rating unit forward current i f 700 ma pulse forward current i fp 1000 ma allowable reverse current i r 85 ma power dissipation p d 2.66 w operating temperature t opr -40~100 c storage temperature t stg -40~100 c junction temperature t j 150 c * absolute maximum ratings at t s =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ unit forward voltage v f i f =350ma 3.3 v luminous flux v i f =350ma 95 lm luminous intensity i v i f =350ma 32 cd x - i f =350ma 0.41 - chromaticity coordinate y - i f =350ma 0.39 - color rendering r a i f =350ma 80 - * characteristics at t s =25c. * luminous flux value as per cie 127:2007 standard. * chromaticity coordinates as per cie 1931 chromaticity chart. * this product is recommended to op erate with the drive current from i f 100ma to 630ma.
nichia sts-da1-2292 2 ranks item rank min max unit forward voltage - 3.0 3.8 v b10 100 110 b09 90 100 b08 80 90 luminous flux b07 70 80 lm color rendering - 75 - - color ranks rank sw27 rank sw30 x 0.4373 0.4562 0.4813 0.4593 x 0.4147 0.4299 0.4562 0.4373 y 0.3893 0.4260 0.4319 0.3944 y 0.3814 0.4165 0.4260 0.3893 rank sw35 rank sw40 x 0.3898 0.3996 0.4299 0.4147 x 0.3670 0.3736 0.3996 0.3898 y 0.3716 0.4015 0.4165 0.3814 y 0.3578 0.3874 0.4015 0.3716 rank sw45 x 0.3515 0.3548 0.3736 0.3670 y 0.3487 0.3736 0.3874 0.3578 * ranking at t s =25c. * tolerance of measurements of the forward voltage is 0.05v. * tolerance of measurements of the luminous flux is 7%. * tolerance of measurements of the color rendering is 5. * tolerance of measurements of the chromaticity coordinate is 0.005. * a shipment shall consist of leds in a combination of the above ranks. the percentage of each rank in the shipment shall be determined by nichia. luminous flux ranks by color rank ranking by luminous flux ranking by color coordinates b07 b08 b09 b10 sw27,sw30 sw35 sw40,sw45
nichia sts-da1-2292 3 chromaticity diagram sw27 sw35 sw30 sw40 sw45 0.25 0.30 0.35 0.40 0.45 0.50 0.30 0.35 0.40 0.45 0.50 0.55 x y
nichia sts-da1-2292 4 outline dimensions sts-da7-0136b ncsx119x-hx ? no. ( g unit: mm) this product complies with rohs directive. u? rohs ?m??? * ( g unit: mm, tolerance: 0.2) ka o protection device 0.45 2 1.4 3.17 anode cathode 0.5 3.17 cathode mark 3.5 3.5 2.6 ? item ??`| package materials ??| encapsulating resin materials ?O| electrodes materials ??| lens materials | weight description ?? ceramics ?`? ( w? silicone resin(with phosphor) ? au-plated ?`? silicone resin 0.033g(typ)
nichia sts-da1-2292 5 soldering ? recommended reflow soldering condition(lead-free solder) ? recommended hand soldering condition temperature 350c max soldering time 3sec max recommended soldering pad pattern ( g unit: mm) 4.1 3.5 0.6 * this led is designed to be reflow soldered on to a pc b. if dip soldered, nichia cannot guarantee its reliability. * reflow soldering must not be performed more than twic e. hand soldering must not be performed more than once. * avoid rapid cooling. ramp down the temper ature gradually from th e peak temperature. * nitrogen reflow soldering is re commended. air flow soldering condit ions can cause optical degradation, caused by heat and/or atmosphere. * since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. pressure can cause nicks, chip-outs, encapsulant delamina tion and deformation, and bump breaks, decreasing reliability. when using automatic pick and place machine, use a pick up nozzle which does not directly apply stress to the encapsulation of the leds. recommended conditions: it is recommended to use a pick up nozzle designed for the leds. (see figure below.) * avoid direct contact to the resin lens with the picking up nozzle. failure to comply might result in catastrophic failure of the leds due to bump damage or breakage. ( g unit: mm) 0.4 3 3.8 1.9 * repairing should not be done after the leds ha ve been soldered. when repairing is unavoidable, a double-head soldering iron should be used. it should be confirmed beforehand whether the characteri stics of the leds will or will not be damaged by repairing. * when soldering, do not apply stre ss to the led while the led is hot. 120sec max pre-heat 180 to 200c 260c max 10sec max 60sec max above 220c 1 to 5c per sec
nichia sts-da1-2292 6 tape and reel dimensions ?` / ` trailer and leader ???`?` embossed carrier tape ???` top cover tape feed direction ` 400mm leader without top cover tape 400mm min ?` 160mm ? trailer 160mm min(empty pockets) led ?? loaded pockets 100mm ? leader with top cover tape 100mm min(empty pocket) nxxx119x sts-da7-0106a quantity per reel=3500pcs 1 `?? 3500 ? the tape packing method complies with jis c 0806 (packaging of electronic components on continuous tapes). * jis c 0806 ???`??????? ?`??? tape 1.75 0.1 8 0.1 2 0.05 4 0.1 5.5 0.05 -0 1.5 +0.1 12 +0.3 -0.1 `? reel * 80 1 17.5 1 13.5 1 1 3 0 . 2 330 2 ? label 21 0 . 8 ( g unit: mm) ? no. 1.5 +0.2 cathode mark -0 3.7 0.1 3.7 0.1 0.25 0.05 2.25 0.1
nichia sts-da1-2292 7 packaging - tape & reel nichia led sts-da7-0006b nxxxxxxx ? label ? label ? no. reel ` ?` seal moisture-proof bag ?? ? for details, see "lot numbering scheme" in this document. * ??????????? if not provided, it is not indicated on the label. ******* is the customer part number. O??????? * ******* ?? the label does not have the rank field for un-ranked products. * ??????????? rohs nxxxxxxx xxxx led ******* nichia corporation 491 oka, kaminaka, anan, tokushima, japan type lot qty. ymxxxx-rrr pcs rohs nxxxxxxx xxxx led ******* rrr pcs type rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan reels are shipped with desiccants in heat-seale d moisture-proof bags. ????`??????`???? desiccants ? products shipped on tape and reel are packed in a moisture-proof bag. they are shipped in cardboard boxes to protect th em from external forces during transportation. ??\H?y?B???y? * ?`???????y?????? * ?QH??n?????u?p?????? * * u???`?????n?go??`y? using an original packaging material or equivalent in transit is recommended. do not expose to water, the box is not water-resistant. do not drop or shock the box. it may damage the products. moisture-proof bags are packed in cardboard boxes with corrugated partitions. ??K???`?
nichia sts-da1-2292 8 lot numbering scheme lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2009 9 2010 a 2011 b 2012 c 2013 d 2014 e m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx-nichia's product number rrr-ranking by color coordinates, ranking by luminous flux
nichia sts-da1-2292 9 derating characteristics ncsx119-hx sts-da7-2328 ? no. derating1 100 300 500 700 900 11 00 0 20406080100120 (1 00, 70 0) (75, 700) (50, 700) (100, 469) (100, 352) derating2 10 0 30 0 50 0 70 0 90 0 110 0 0 20 406080100120 (100, 700) duty 100 1000 10000 1 10 100 700 S allowable forward current ( ma ) `??????-S solder te mpe rature(c athode side) vs allowable forward current ??-S ambient tempe rature vs allowable forward current S allowable forward current(ma) S allo wable forward current(ma) `?????? solder temperature(cathode side)(c) ?? ambient temperature(c) ?` ?` duty ratio(%) ?`?`-S duty ratio vs allowable forward current t a =25c 20c/w 30c/w 40c/w ja r = ja r = ja r = this product is recommended to operate with the drive current from i f 100 ma to 630 ma. u?? 100ma 630ma ?????X? *
nichia sts-da1-2292 10 optical characteristics NCSL119-H3 ? no. sts-da7-2262 spectrum 0.0 0.2 0.4 0.6 0.8 1.0 400 450 500 5 50 600 650 700 750 8 00 ? relative illuminance(a.u.) directivity1 90 80 70 60 50 40 30 20 10 0 -10 -2 0 -30 -4 0 -50 -6 0 -7 0 -80 -9 0 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 10.500.5 1 * ??? all characteristics shown are for reference only and are not guaranteed. 35 0ma i fp = t a =25c 35 0ma i fp = t a =25c
nichia sts-da1-2292 11 forward current characteristics / temperature characteristics ncsl119-hx sts-da7-2258 ? no. tavf 2.0 2.5 3.0 3.5 4.0 4.5 -60 -40 -2 0 0 20 40 60 80 1 00 120 ta iv 0.6 0.8 1.0 1.2 1.4 -60 -40 -20 0 20 40 60 8 0 100 120 vfif 10 100 10 00 2.02.53.0 3.54.04.5 35 0 relative luminous flux(a.u.) ??- ambient temperature vs relative luminous flux for ward curren t( m a) ifiv 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 200 400 600 800 1000 1 200 relative luminous flux(a.u.) - forward current vs relative luminous flux forw ard current(ma) ?R- forward voltage vs forward current ??-?R ambient temperature vs forward voltage ?R forward volta g e(v) ?R forward voltage(v) ?? ambient tem p erature ( c ) ?? ambient temperature(c) t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. t a =25c i fp = 350ma i fp = 350ma
nichia sts-da1-2292 12 forward current characteristics / temperature characteristics ? no. NCSL119-H3 sts-da7-2263 taxy 0.35 0.36 0.37 0.38 0.39 0.34 0.35 0.36 0.37 0.38 -4 0c 0 c 25c 50 c 100c x ifxy 0.35 0.36 0.37 0.38 0.39 0.34 0.35 0.36 0.37 0.38 20ma 350ma 100 0m a 100ma 700ma x y y 350ma i fp = ? ? -? ambie nt te mperature vs chromaticity c oordinate -? forward current vs chromaticity c oordinate t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. * ??? sw40, sw45( ???e???? ) ???? the graphs above show the characteristics for sw40 and sw45 leds, including sub-bins, of this product.
nichia sts-da1-2292 13 forward current characteristics / temperature characteristics ? no. NCSL119-H3 sts-da7-2264 taxy 0.37 0.38 0.39 0.40 0.41 0.39 0 .40 0.41 0.42 0.43 -40c 0 c 25c 100c 50 c x ifxy 0.37 0.38 0.39 0.40 0.41 0.39 0 .40 0.41 0.42 0 .4 3 20ma 35 0m a 1000ma 10 0m a 70 0ma x y y 350ma i fp = ? ? -? ambie nt te mperature vs chromaticity c oordinate -? forward current vs chromaticity c oordinate t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. * ??? sw27, sw30, sw35( ???e???? ) ???? the graphs above show the characteristics for sw27, sw30 and sw35 leds, including sub-bins, of this product.
nichia sts-da1-2292 14 reliability (1) tests and results te s t reference standard test conditions te s t duration failure criteria # units failed/tested resistance to soldering heat (reflow soldering) jeita ed-4701 300 301 t sld =260c, 10sec, 2reflows, precondition: 30c, 70%rh, 168hr #1 0/22 solderability (reflow soldering) jeita ed-4701 303 303a t sld =2455c, 5sec, lead-free solder(sn-3.0ag-0.5cu) #2 0/22 temperature cycle jeita ed-4701 100 105 -40c(30min)~25c(5min)~ 100c(30min)~25c(5min) 100cycles #1 0/22 moisture resistance (cyclic) jeita ed-4701 200 203 25c~65c~-10c, 90%rh, 24hr per cycle 10cycles #1 0/22 high temperature storage jeita ed-4701 200 201 t a =100c 1000hours #1 0/22 temperature humidity storage jeita ed-4701 100 103 t a =60c, rh=90% 1000hours #1 0/22 low temperature storage jeita ed-4701 200 202 t a =-40c 1000hours #1 0/22 room temperature operating life t a =25c, i f =700ma test board: see notes below 1000hours #1 0/22 high temperature operating life t a =100c, i f =300ma test board: see notes below 1000hours #1 0/22 temperature humidity operating life 60c, rh=90%, i f =600ma test board: see notes below 500hours #1 0/22 low temperature operating life t a =-40c, i f =350ma test board: see notes below 1000hours #1 0/22 vibration jeita ed-4701 400 403 200m/s 2 , 100~2000~100hz, 4cycles, 4min, each x, y, z 48minutes #1 0/10 electrostatic discharges jeita ed-4701 300 304 hbm, 2kv, 1.5k ? , 100pf, 3pulses, alternately positi ve or negative #1 0/22 notes: 1) test board: fr4 board thickness=1.6mm, copper layer thickness=0.07mm, r ja 40c/w 2) measurements are performed after allo wing the leds to return to room temperature. (2) failure criteria criteria # items conditions failure criteria forward voltage(v f ) i f =350ma >initial value1.1 #1 luminous flux( v ) i f =350ma nichia sts-da1-2292 15 cautions (1) storage conditions te m p e ra t u r e humidity time before opening aluminum bag 30c 90%rh within 1 year from delivery date storage after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product complies with jedec msl 3 or equivalent. se e ipc/jedec std-020 for moisture-sensitivity details. absorbed moisture in led packages can vaporize and expand during soldering, which can cause interface delamination and result in optical performance degradation. products are packed in moisture-proof aluminum bags to minimize moisture absorptio n during transportation and storage. included silica gel desiccants change from blue to red if moisture had penetrated bags. after opening the moisture-proof aluminum bag, the products should go through the soldering process within the range of the conditions stated above. unused remaining leds should be stored with silica gel desiccants in a hermetically sealed container, prefer ably the original moisture -proof bags for storage. after the ?period after opening? stor age time has been exceeded or silica gel desiccants are no longer blue, the products should be baked. baking should only be done once. although the leads or electrode pads (anode and cathode) of the product are plated with gold, prolonged exposure to a corrosive en vironment might cause the gold plated th e leads or electrode pads to tarnish, and thus leading to difficulties in sold ering. if unused leds remain, they must be stored in a hermetically sealed container . nichia recommends using the or iginal moisture-proof bag for storage. do not use sulfur-containing materials in commercial products. some materials, such as seals and adhesives, may contain sulfur . the contaminated plating of leds might cause an open circ uit. silicone rubber is recommen ded as a material for seals. bear in mind, the use of silicones may lead to silicone contamination of electrical contacts inside the products, caused by low molecular weight volatile siloxane. to prevent water condensation, please avoid large temperat ure and humidity fluctuations for the storage conditions. (2) directions for use when designing a circuit, the current through each led must not exceed the absolute maximum rating. operating at a constant current per led is recommended. in case of operating at a constant voltage, circuit b is recommended . if the leds are operated with constant voltage using circui t a, the current through the leds may vary due to the variation in forward voltage ch aracteristics of the leds. (a) ... (b) ... leds should be operated in forward bias. driving circuits must not subject leds to either forward or reverse voltage while off . continuous reverse voltage can cause migration and led damage. for stabilizing the led characteristics, it is recommended to operate at greater than 10% nominal current. for outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage. (3) handling precautions do not handle leds with bare hands, it may contaminate the led surface and affect optical characteristics. in the worst case, catastrophic failure from excess pres sure through bump-bond breaks and package damage may result. when handling the product with tweezers, be careful not to apply excessive force to the resin. otherwise, the resin can be cut, ch ipped, delaminate or deform ed, causing bump-bond breaks and catastrophic failures. dropping the produc t may cause damage. do not stack assembled pcbs together. fa ilure to comply can cause the resin portio n of the product to be cut, chipped, delaminated and/or deformed. it may cause bu mp to break, leading to catastrophic failures.
nichia sts-da1-2292 16 (4) design consideration pcb warpage after mounting the products on to a pcb can cause the package to break. the led should be placed in a way to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechan ical stress is exerted on the leds placed near the score lines. the led should be placed in a way to minimize the stress on the leds due to board flexing. board separation must be performed using special jigs, not using hands. if an aluminum pcb is used, customer is advised to verity the pcb with the products before use. thermal stress during use can cause the solder joints to crack. (5) electrostatic discharge (esd) the products are sensitive to static electricity or surge voltage. esd can damage a die and its reliability. when handling the products, the following measures against electrostatic discharge are strongly recommended: eliminating the charge grounded wriststrap, es d footwear, clothes, and floors grounded workstation equipment and tools esd table/shelf mat made of conductive materials proper grounding is required for all devices, equipment, and machinery used in product assembly. surge protection should be considered when design ing of commercial products. if tools or equipment contain insulating materials such as glass or plastic, the following measures against electros tatic discharge are strongly recommended: dissipating static charge with conductive materials preventing charge generation with moisture neutralizing the charge with ionizers the customer is advised to chec k if the leds are damaged by esd when performing the characteristics inspection of the leds in the application. damage can be detected with a forward voltag e measurement or a light-up test at low current ( 1ma). esd damaged leds may have current flow at a low voltage or no longer illuminate at a low current. failure criteria: v f <2.0v at i f =0.5ma (6) thermal management proper thermal management is an impo rtant when designing produc ts with leds. led die temperature is affected by pcb thermal resistance and led spacing on the board. please design products in a way that the led die temperature does not exceed the maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. the following equations can be used to calculate the junction temperature of the products. 1) t j =t a +r ja ? w 2) t j =t s +r js ? w *t j =led junction temperature: c t a =ambient temperature: c t s =soldering temperature (cathode side): c r ja =thermal resistance from junction to ambient: c/w r js =thermal resistance from junction to t s measuring point 13c/w w=input power(i f v f ): w ts point
nichia sts-da1-2292 17 (7) cleaning if required, isopropyl alcohol (ipa) should be used. ot her solvents may cause premature failure to the leds due to the damage to the resin portion. the effects of such solvents should be verified prior to use. in addition, the use of cfcs such as freon is heavily regulated. ultrasonic cleaning is not recommended since it may have adverse effects on the leds depending on the ultrasonic power and how led is assembled. if ultrasonic cleaning must be used, the customer is advised to make sure the leds will not be damaged prior to cleaning. (8) eye safety in 2006, the international electrical commission (iec ) published iec 62471:2006 photobiological safety of lamps and lamp systems, which added leds in its scope. on the other hand, the iec 60825-1:2007 laser safety standard removed leds from its scope. however, please be advised that some countries and regions ha ve adopted standards based on the iec laser safety standard iec 60825-1: 20112001, which still includes leds in its scope. most of nichia's leds can be classified as belo nging into either the exempt group or risk group 1. high-power leds, that emit ligh t containing blue wavelengths, may be classified as risk group 2. please proceed with caution when viewing directly any leds driven at high current, or viewing leds with optical instruments which may greatly increase the damages to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, please be careful to avoid adverse effects on the human body caused by light stimulation. (9) others the leds described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia's sales staff in advance for information on the applicat ions in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersibl e repeaters, nuc lear reactor control system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer shall inform nichia directly before disassembling or analysis. both the customers and nichia will agree on official specificatio ns of supplied produc ts before a customer 's volume production . specifications and appearance subject to change for improvement without notice.


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